Semiconductor sorona

We Make future

Display sorona

Dreams come true

LED sorona

For human beings

당사는 그동안 축적해온 반도체, 디스플레이 등의 제조공정 기술을 바탕으로 반도체, 디스플레이, LED, MEMS등의 제조에 사용되는 박막증착 및 식각 장비를 생산하는 전문업체입니다.

국내 유수의 반도체 제조업체 및 연구기관에 안정적인 공급을 하고 있고, 기술의 다각화 및 다양한 분야로의 해외시장 진출을 통하여 지속적으로 성장하고 있습니다. 당사는 끊임없는 연구개발과 독자적인 기술개발을 통해 세계최고의 기술력을 갖춘 반도체, FPD 장치분야의 일등기업이 되도록 정진하고 있습니다.

저희 임직원은 항상 변화와 창조적 사고를 바탕으로, 보다 더 나은 제품과 서비스에 초점을 맞춰, 고객의 다양한 요구에 부응하는 제품개발에 총력을 기울여 최고의 가치를 창조하는 파트너가 되겠습니다.

introduction

회 사 명
(주) 소로나 (SORONA INC.)
대 표 이 사
윤능구
설 립 년 도
2004년 12월
회 사 소 개

반도체 및 디스플레이, LED용 증착 및 식각 장비 전문 125-81-55609 www.sorona.co.kr

History

2004
(주) 소로나 설립
2005
부설연구소 설립
ISO9001:2000 품질경영시스템 인증, 벤처기업 인증, CE 인증
2008
PECVD System 개발
2009
SAM Coating System 개발
2011
ICP Dry Etching System 개발
2012
NASA(USA) 협력사 등록
2013
SiGe Epi Growing System NASA 수출
2014
Microwave Ashing System 개발
2015
대면적 ICP Dry Etching System 개발
2017
Plasma Treatment System 개발
2018
HSC Sputtering System 개발
In-Line PECVD System 개발
2019
사옥 이전
2020
300mm Sputtering System 개발
2022
SRN-420 PECVD, SRN-320 RIE 유럽 수출
2023
SRN-120 Sputter 유럽수출
2024
반도체-이차전지 제조용 스퍼터링 시스템 개발
2025
SRN-330S ICP Etcher 유럽수출

History

Technology

Manufacturing

SPUTTERING SYSTEM
EVAPORATOR
ICP ETCHER
CVD
INLINE PECVD
INLINE SPUTTER
VAPOR SAM
PLASMA TREATMENT
COATING SERVICE

cluster sputter

SRN-110M

Versatile deposition
Smart Co-deposition support
Unlimited multi layer coating using maximum 12 targets
Protection of the target contamination by intelligent target shield design
Improved convenience of chamber shield exchange
Minimal footprint as compared with quantity of target
Rotating substrate table with RF Bias and heating options

MULTI-TARGET SPUTTER

SRN-120c4

Multi purpose single load-lock sputtering system
Smart Co-deposition support
4 cathodes with 4inch target
Available 200mm wafer deposition
Excellent uniformity
Ciompact design(1170W x 1400D x 1700H)

SRN-120c7

Multi purpose single load-lock sputtering system
Smart Co-deposition support
4 cathodes with 7inch target
Available 100mm ~ 200mm wafer deposition
Excellent uniformity
Compact design(1170W x 1400D x 1700H)
Continuous multi-layer coating

SRN-120c10

Multi purpose single load-lock sputtering system
Smart Co-deposition support
4 cathodes with 10inch target
Available 100mm ~ 300mm wafer deposition
Excellent uniformity
Compact design(1170W x 1400D x 1700H)
Continuous multi-layer coating

direct sputter

SRN-130c10

Face to face direct sputtering
SAW filter manufacturing
MEMS application
Passivation layer coating
Outstanding step coverage rate
(>30%@ 0.38um Via / 1.8um Depth)

REACTIVE SPUTTER

SRN-130r

Face to face reactive sputtering
Available 300mm wafer deposition
Highly quality AlN growing (FWHM < 300 arcsec)
SAW filter manufacturing
MEMS application
LED AlN Buffer layer
Passivation layer coating

INLINE SPUTTER

SRN-140G

Vertical type INLINE Sputter
Rotary Cathode target
Available 8 generation display
Reactive sputtering(SiO2, Si3N4, TiO2, CrOx)
SiO2 Dep rate > 50Å/min
Excellent quality SiO2 Film deposition
LED Package passivation

EVAPORATOR

SRN-200

Precise single rotating dome design(8inch wafer 5pcs, standard)
Available planetary design optional
Smart shield design(no need screws or clamp pin)
Dome shutter for precision depo-rate control
Wafer backside heating Max 400℃
Co-evaporation coating or multiple layer deposition using fully automated software

SRN-200L

RIE ETCHER

SRN-320

Single compact load-lock system
Designed for 100~200mm wafer
Compact dimension & easy operation
Poly-Si, SiO2, Si3N4 and compound semiconductor
Profile >85°
Uniformity < 3% @ 8inch Wafer

ICP ETCHER

SRN-330

High etch rate with optimized plasma source
Designed for 100~200mm wafer
Al, Ti, TiN, Mo, AlN and compound semiconductor
Profile >88°
Uniformity(WIW, WTW) < 5% @ 8inch Wafer
No plasma damage

SRN-330L

Optimized for PSS and Oxide etching
World leading capacity 12 wafers x 4inch for PSS
No edge exclusion
Excellent uniformity
Low particle technology
Outstanding shape control

Cluster type

PECVD

SRN-420

SiO2, Si3N4, a-Si Deposition
Minimized footprint
Compact design and Outstanding performance
Controllable film stress
Very fast deposition performance
High grade and excellent uniformity (﹤2% @ 8inch wafer)
Very Fast cleaning time

Stand-alone type

MOCVD

SRN-460

Lab scale MOCVD
Metal organic precursor
Atomic layer deposition
Chalcogenide compound process
PC control

VAPOR SAM

SRN-520

Self-Assembled Monolayer deposition
200mm wafer
Plasma treatment
Anti-stiction layer deposition
Reactive adhesion layer deposition

SRN-530

Vapor deposited monolayer deposition
Large size 400 x 400 mm deposition
Nano imprint/Lithography stamp coating
Sensor anti-sticking prevention
Anti-Fouling barrier

PLASMA TREATMENT

SRN-600

Powerful plasma treatment and organic cleaning
Electron free plasma for electronically sensitive samples
600x500mm Tray module
Easy mode change(Active/Ground/Floating)

COATING SERVICE

Customized coating service
Metal coating(Al, Cu, Ti, TiW, Cr, Ni, Ag, Mo)
Oxide coating(SiO2, Si3N4, ITO, CrOx, TiO2)
Available various sample size(Wafer 300mm, Glass 370x470mm)

오시는 길

경기도 안성시 원곡면 새울길 9-44

Tel 031-667-9954
Fax 031-667-9957
sjpark@sorona.co.kr