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 Home > Product > Etcher > SRIE-300
    SRIE 300

Feature

Single wafer loadlock chamber
Robot arm for wafer handling
TMP and Rotary pump combination
RF generator connected to bottom electrode through a close coupled automatic matching network
Gas pod equipped system frame
Automatic pressure control (APC) valve for process pressure control
Long life mechanical chuck (Electrostatic chuck : option)
Designed for 150mm and 200mm wafer
End point detector (Option)

Fully automation process

Application

     Poly-Si, SiO2, Si3N4 and compound semiconductor (GaN, InN…)

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